VI Meeting of Heads of Financial Market Infrastructures

The VI Meeting of Heads of Financial Market Infrastructures, organized by CEMLA, was held in person in Santiago, Chile, on October 29–30, 2025, bringing together department heads and experts from central banks across the region specializing in payment systems and financial market infrastructures. The meeting was conducted with simultaneous Spanish–English interpretation and focused on the challenges and opportunities arising from technological innovation in payment and settlement systems.

The first day addressed topics related to wholesale settlement in central bank money using new technologies, as well as progress and experiences with retail central bank digital currencies (CBDCs). In addition, participants discussed challenges associated with instant payments and interoperability, highlighting the role of central banks in promoting efficient, secure, and inclusive infrastructures. These sessions facilitated the exchange of practical experiences and reflections on policy implications and system design.

The second day featured a keynote presentation on changes in SWIFT’s oversight and governance, followed by sessions devoted to cross-border payments and to in-house payment system developments by central banks, analyzing their advantages and challenges relative to third-party solutions. The meeting concluded with closing remarks emphasizing the importance of regional cooperation, the sharing of best practices, and the strengthening of technical capacities within central banks in response to an increasingly digital and complex financial environment.